Short courses to be a part of electronics packaging conference

InterPACK — the Pacific Rim/International, Intersociety Electronic Packaging Technical Business Conference and Exhibition — is an internationally known biennial conference that aims to promote international cooperation, understanding and promotion of efforts and disciplines in microelectronics, photonics, microwave and microelectromechanical systems (MEMS) packaging engineering.

InterPACK '01 will take place from July 8 to 13 at the Hyatt Regency Kauai in Kauai, Hawaii. The conference is sponsored by ASME's Electrical and Electronic Packaging Division. The Institute of Electrical and Electronics Engineers and the Japan Society of Mechanical Engineers are participating societies.

InterPACK's technical tracks will focus on all areas of packaging and interconnects of microelectronics, photonics, microwave and MEMS systems, including reliability; packaging technologies; thermal management; electrical design, simulation and testing; modeling and characterization; materials and processes; manufacturing; education; and telecommunication.

The event also will feature a number of keynote presentations, such as "The New Digital Economy," by William Kennard, chairman of the U.S. Federal Communications Commission; "Consortium Activity for System Integration in Japan," by Manabu Bonkohara, director of the Association of Super-Advanced Electronic Technologies, and "Engineering Challenges of Telecommunications in the Next Decade," by Paul Meche, principal scientist for Nokia Mobile Phone.

Vijay Lund, vice president of server technology development at IBM Corp., will also give a keynote presentation, "Future Direction of High-End Computing," as will Jeffrey J. Sniegowski, a member of the technical staff at Sandia National Laboratories, who will speak on "MEMS: A New Packaging Challenge."

Fourteen short courses, sponsored by ASME's Electrical and Electronic Packaging Division, will be offered throughout the conference. These seminars will focus on such areas as low-cost flip chip processing and analysis, predictive computer-aided design for reliability in electronic packaging, thermal management of high-power electronic equipment, thermal design for electronics cooling, and microelectronics and fiber-optics structures.

Other InterPACK short courses will explore electrically conductive adhesives, MEMS, design of thermofluid systems for cooling of electronics, experimental methods in electronics cooling, practical methods to design in and predict surface mount attachment reliability, artificial neural networks, high-performance computing and optoelectronics packaging, and thermal design of electronic systems.

Registration for InterPACK '01 is $550 for members of ASME and cooperating societies, $660 for nonmembers. One-day registration is $290 for members, $390 for nonmembers. Registration is $25 for ASME retired Life Members, and $5 for nonmember students. ASME student members may register free of charge.

For more information, contact Information Central, (800) 843-2763 or (973) 882-1167; or www.asme.org/conf/confers.html.

back to meetings & courses